High-volume millimeter scale manufacturing

ABSTRACT

A method for manufacturing a millimeter scale electromechanical device includes coupling a stainless steel ply to a polymer carrier ply, coating the stainless steel ply in a photo resist material, masking the photoresist material, exposing the photoresist material to cure a portion of the photoresist material, developing the photoresist material to remove uncured photoresist material from the stainless steel ply, chemically etching the stainless steel ply to remove a patterned portion of the stainless steel ply, dissolving the polymer carrier ply to release unwanted chips of the stainless steel ply, and adhering the patterned stainless steel ply to a flexible material ply to form a sub-laminate.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a U.S. Nonprovisional Application under 35U.S.C. 111(a) of international application PCT/US2017/047869, having aninternational filing date of Aug. 21, 2017, and published as WO2017/189928, which in turn claims the benefit of U.S. provisional patentapplication No. 62/377,511, filed on Aug. 19, 2016 and of U.S.provisional patent application No. 62/377,661, filed on Aug. 21, 2016and of U.S. provisional patent application No. 62/381,492, filed on Aug.30, 2016 the disclosures of all of the foregoing are incorporated in thepresent application by reference in their entirety. The presentapplication is a continuation-in-part of U.S. patent application Ser.No. 16/173,922, filed on Oct. 29, 2018, which is a continuation ofinternational application number PCT/US2017/029975, filed on Apr. 27,2017, and published as WO 201.7/189929 which in turn claims the benefitof U.S. provisional patent application No. 62/328,524, filed on Apr. 27,2016 the disclosures of which are incorporated herein by reference intheir entirety. The present application is a continuation-in-part ofU.S. patent application Ser. No. 16/173,922, filed on Oct. 29, 2018,which in turn is a continuation-in-part of U.S. application Ser. No.15/242,508, filed on Aug. 20, 2016, which in turn is acontinuation-in-part of international application numberPCT/US2015/015509, filed on Feb. 11, 2015, which claims benefit of U.S.provisional application No. 62/051,358, filed on Sep. 17, 2014 andclaims benefit of U.S. provisional application No. 61/938,613, filed onFeb. 11, 2014 the disclosures of which are incorporated herein byreference in their entirety. The present application is acontinuation-in-part of U.S. patent application Ser. No. 16/173,922,filed on Oct. 29, 2018, which in turn is a continuation-in-part of U.S.application Ser. No. 15/242,508, filed on Aug. 20, 2016, which in turnis a continuation-in-part of international application numberPCT/US2016/028185, filed on Apr. 18, 2016, which claims benefit of U.S.provisional application No. 62/148,732, filed on Apr. 16, 2015 andclaims benefit of U.S. provisional application No. 62/180,974, filed onJun. 17, 2015 and claims benefit of U.S. provisional application No.62/289,147, filed on Jan. 29, 2016 the disclosures of which areincorporated herein by reference in their entirety. The presentapplication is a continuation-in-part of U.S. patent application Ser.No. 16/173,922, filed on Oct. 29, 2018, which in turn is acontinuation-in-part of U.S. application Ser. No. 15/242,508, filed onAug. 20, 2016, which claims benefit of U.S. provisional application No.62/328,524, filed on Apr. 27, 2016 the disclosures of which areincorporated herein by reference in their entirety. The presentapplication is a continuation-in-part of U.S. patent application Ser.No. 15/242,508, filed Aug. 20, 2016, which claims the benefit of U.S.provisional patent application No. 62/328,524, filed on Apr. 27, 2016,and which is a continuation-in-part of international applicationPCT/US2016/028185 filed on Apr. 18, 2016 which claims the benefit ofU.S. provisional application No. 62/148,732, filed on Apr. 16, 2015 andof U.S. provisional application No. 62/180,974, filed on Jun. 17, 2015and of 62/289,147, filed on Jan. 29, 2016, and which is acontinuation-in-part of international application PCT/US2015/015509,filed on Feb. 11, 2015 which claims the benefit of U.S. provisionalpatent application No. 62/051,358, filed Sep. 17, 2014 and of U.S.provisional patent application No. 61/938,613, filed on Feb. 11, 2014the disclosures of which are incorporated herein by reference in theirentirety. The present application is a continuation-in-part of U.S.patent application Ser. No. 15/073,436 filed on Mar. 17, 2016 which is acontinuation-in-part of U.S. nonprovisional application Ser. No.14/834,336 filed on Aug. 24, 2015 which in turn claims benefit of U.S.provisional patent application No. 61/933,037, filed on Jan. 29, 2014and U.S. provisional application No. 61/933,027, filed on Jan. 29, 2014and of U.S. provisional application No. 62/051,355, filed on Sep. 17,2014 the disclosures of which are incorporated herein by reference intheir entirety. The present application is a continuation-in-part ofU.S. patent application Ser. No. 15/073,436 filed on Mar. 17, 2016 whichis a continuation-in-part of U.S. nonprovisional application Ser. No.14/834,336 filed on Aug. 24, 2015 which in turn is acontinuation-in-part of international application numberPCT/US2014/018096, filed on Feb. 24, 2014 which in turn claims benefitof U.S. provisional application No. 61/768,397, Feb. 22, 2013 and ofU.S. provisional application No. 61/768,494, filed on Feb. 24, 2013 andof U.S. provisional application No. 61/771,847, filed on Mar. 2, 2013and of U.S. provisional application No. 61/772,239, filed on Mar. 4,2013 and of U.S. provisional application No. 61/772,257, filed on Mar.4, 2013 and of U.S. provisional application No. 61/775,852, filed onMar. 11, 2013 and of U.S. provisional application No. 61/775,867, filedon Mar. 11, 2013 and of U.S. provisional application No. 61/788,698,filed on Mar. 15, 2013 and of U.S. provisional application No.61/821,495, filed on May 9, 2013 the disclosures of which areincorporated herein by reference in their entirety. The presentapplication is a continuation-in-part of U.S. patent application Ser.No. 15/073,436 filed on Mar. 17, 2016 which is a continuation ofinternational application number PCT/US2014/056165, filed on Sep. 17,2014 which in turn claims benefit of U.S. provisional application No.61/878,979, filed on Sep. 17, 2013 and of U.S. provisional applicationNo. 61/930,359, filed on Jan. 22, 2014 and of U.S. provisionalapplication No. 61/930,370, filed on Jan. 22, 2014 and of U.S.provisional application No. 61/955,614, filed on Mar. 19, 2014 thedisclosures of which are incorporated herein by reference in theirentirety. The present application is a continuation-in-part of U.S.patent application Ser. No. 14/834,336 filed on Aug. 24, 2015 whichclaims the benefit of U.S. provisional patent application No. 62/051,355filed on Sep. 17, 2014, and which is a continuation-in-part ofinternational application PCT/US2014/018096 filed on Feb. 24, 2014 whichclaims benefit of U.S. provisional application 61/768,397, filed on Feb.22, 2013 and of U.S. provisional application No. 61/768,494 filed onFeb. 24, 2013 and of U.S. provisional application No. 61/771,847, filedon Mar. 2, 2013 and of U.S. provisional application No. 61/772,239,filed on Mar. 4, 2013 and of U.S. provisional application No. 61/772,257filed on Mar. 4, 2013 and of U.S. provisional application No.61/775,852, filed on Mar. 11, 2013 and of U.S. provisional applicationNo. 61/775,867, filed on Mar. 11, 2013 and of U.S. provisionalapplication No. 61/788,698, filed on Mar. 15, 2013 and of U.S.provisional application No. 61/821,495, filed on May 9, 2013 and of U.S.provisional application No. 61/933,037, filed on Jan. 29, 2014 and ofU.S. provisional application No. 61/933,027, filed on Jan. 29, 2014 thedisclosures of which are incorporated herein by reference in theirentirety.

FIELD OF THE INVENTION

The present invention relates to features of a manufactured assembly andmore particularly to methods and assembly features of a manufacturedlaminated assembly.

SUMMARY

The ability to manufacture goods efficiently and with superiorfunctionality has long been a key determinant of economic success forindividuals, enterprises and societies. Contrary to popular perception,most innovation takes place through an evolutionary process in whichpre-existing elements are recombined in surprisingly useful ways, ratherthan as a radical departure from the status quo. This is true ofinnovations in apparatus and methods and also in manufacturingtechniques.

The history of manufactured goods spans a long series of transitionsacross materials (from wood, stone and leather to gold, copper, bronze,iron and steel and on to various synthetic materials including, amongothers, man-made polymers. Likewise, the techniques of manufacturinghave evolved from the preparation of individual items through thedevelopment of interchangeable parts, moving assembly lines and variousphotolithographic techniques for the preparation of circuit boards,integrated circuits and micro-electromechanical (MEMS) systems.

MEMS systems predominate among mechanical devices at the micron scaleand typically involve the bulk addition and removal of materials inserial fashion from a single substantially planar substrate. Traditionalmachining and fabrication practices are readily applicable to devicesfrom centimeter scale up to meters (e.g. large machine tools anddynamos).

While these developments have led to a remarkable abundance and varietyof products, one that would astound the most prescient individual of acentury ago, there remain apparatus and systems that are persistentlydifficult, time-consuming and consequently expensive to manufacture. Inparticular, manufacturing at the millimeter scale, remains challengingfor a variety of reasons.

The inventors of the present invention has conceived and implement and afundamental advancement in manufacturing technology at this millimeterscale. As described, for example, in PCT patent application numberPCT/US 2014/018096 (WO2014130967) (the disclosure which is herewithincorporated by reference in its entirety) the present inventors havecreated a useful and fundamentally novel manufacturing technique (asexemplified in numerous devices) that readily allows mass production ofmillimeter scale mechanical, electromechanical, pneumatic and hydraulicdevices, among others, at high volume and low cost and demonstratingrobustness and effectiveness unmatched by other technologies in theprior art.

This new technology and method includes the assembly of more or lessflexible and more or less rigid layered materials in a generallytwo-dimensional format and, thereafter, activating these assemblies toachieve operative systems with multiple degrees of freedom and, in manycases, a generally three-dimensional aspect. This groundbreakingtechnology is termed μMECS™.

Now, having achieved still further advancements, and thereby achievingsurprising and unexpected results, beneficial to the technology broadly,and to the numerous and various disciplines that it improves andenables, the inventors herewith present systems, methods and apparatusrelated to high-volume manufacturing at the millimeter scale.

The methods presented here enable high volume, low cost fabrication ofμMECS™ components. These processes represent significant improvements tothroughput and cost over state of the art prototype methods, enablingμMECS™ components for high volume consumer markets.

Throughout this work a reference component, the Thumper™ HapticCommunicator (THC), is used to quantify process improvements for acomponent targeting high volume consumer markets. A preferred embodimentof THC fabrication at high volumes follows the detailed description ofinventions. A summary of key innovations that enable high volume μMECScomponent manufacturing include:

-   -   Use of a printable/patternable rapid curing adhesive for        multilayer lamination and component assembly. Rapid cure        mechanisms include pressure sensitive adhesives (PSA), light        curing (UV/visible), delayed light cure, and thermal snapcure        adhesives with setting/cure times <5 minutes. A reduction in        lamination cycle time from 5 hours to <1 minute is possible.    -   Use of a high throughput, batch adhesive patterning process        based on die cutting, screen/stencil printing, jetting, pad        printing, or photo-patterning. To fabricate THC using state of        the art UV laser machining requires 30 minutes per part. Batch        processes can pattern an entire panel in seconds per adhesive        layer.    -   Use of mask-less adhesive printing processes to assemble linkage        and spacer sub-laminates. In many cases, linkages and spacers do        not require independent adhesive patterning; the adhesive        pattern matches that of an adjoining ply. In this scenario, the        material ply can be used as a mask to define the adhesive        pattern in continuous or batch processes. Example processes        include ultrasonic spray (deposit adhesive in seconds per ply)        and selective wet/dry etching (remove adhesive in minutes per        batch).    -   Use of printed flex circuits as linkage laminate and spacers.        Examples include using double-sided stainless steel flex        circuits or fine line copper circuits as linkage laminates.        Fabrication steps are analogous to those employed in the        manufacture of flexible Printed Circuit Board (PCB) (e.g.        photolithography and wet etch features). This method enables        high throughput linkage and spacer fabrication with existing PCB        manufacturing lines. An additional benefit is bridge-less rigid        plies; stainless steel can be patterned with material islands,        retained to webbing by flex material, improving throughput and        capital equipment cost. (Mylar™ polyester).    -   Use of a rapidly machinable carrier for substrate transport.        This method enables direct patterning of islands of material in        μMECS plies, unsupported by bridges (but supported by carrier).        The aim of this method is to simplify release processing; by        patterning rigid structural plies (e.g. stainless steel) without        bridges, release is carried out on thin, easily machined plastic        films. Example carriers include a thin film, rapidly machinable        substrate (e.g. Polyimide, Polyester) or soluble film that can        be dissolved after lamination (e.g. Polyvinyl Alcohol). In the        case of linkage laminates the flex ply can double as a carrier        film, further simplifying processing.

Having examined and understood a range of previously available devices,the inventors of the present invention has developed a new and importantunderstanding of the problems associated with the prior art and, out ofthis novel understanding, has developed new and useful solutions andimproved devices, including solutions and devices yielding surprisingand beneficial results.

Certain exemplary structures, prepared according to principles of theinvention, will include laminated structures created from substantiallyflat source layers of material. Three-dimensional assemblies are formedthrough subtractive machining and additive lamination of these flatlayers. Such a methodology creates two and a half dimensional structuresbuilt from the layers. In addition, certain three-dimensional structureswill be added to the assembly for their beneficial effect.

For example, The micro-Multilayer Etched Composite Systems (μMECS™)process is used to manufacture low profile electromechanical systems.Generally, μMECS components consist of linkage mechanisms fabricated bylayering sheets of patterned, rigid and flexible materials. The simplestembodiment of a μMECS component, a flexible hinge (‘flexure’), consistsof two rigid links connected by a compliant bending beam. The flexureapproximates the motion of a pin joint by elastically deforming underapplied loads. Flexures exist at many scales, however the μMECS processenables very small (0.1 millimeter to 10 centimeter) hinges.

The unit flexure hinge can be fabricated using the generic processdescribed below (See FIG. 1). Previously, methods have been describedfor preparing μMECS™ systems at prototype manufacturing volumes.

The invention encompassing these new and useful solutions and improveddevices is described below in its various aspects with reference toseveral exemplary embodiments including a preferred embodiment.

These and other advantages and features of the invention will be morereadily understood in relation to the following detailed description ofthe invention, which is provided in conjunction with the accompanyingdrawings. It should be noted that, while the various figures of thefollowing drawings show respective aspects of the invention, no onefigure is intended to show the entire invention. Rather, the figurestogether illustrate the invention in its various aspects and principles.As such, it should not be presumed that any particular figure isexclusively related to a discrete aspect or species of the invention. Tothe contrary, one of skill in the art will appreciate that the figurestaken together reflect various embodiments exemplifying the invention.

Correspondingly, referenced throughout the specification to “oneembodiment” or “an embodiment” means that a particular feature,structure, or characteristic described in connection with the embodimentis included in at least one embodiment of the present invention. Thus,the appearance of the phrases “in one embodiment” or “in an embodiment”in various places throughout the specification are not necessarily allreferring to the same embodiment. Furthermore, the particular features,structures, or characteristics may be combined in any suitable manner inone or more embodiments.

In the interests of clarity, the following definitions are provided:

Flexure: A hinge comprised of a compliant material that elasticallydeforms, approximating the motion of a pin joint.

Substrate: In the context of μMECS™ component, substrate refers tomaterial that provides function and is retained within a MECS'component.

Chip: In contrast to substrate, chips are present during fabrication butare sacrificial and released from the final μMECS™ component.

Bridge: In the context of μMECS™, bridges retain substrate material tosurrounding webbing during processing. Bridges are released to free theμMECS™ component degrees of freedom.

Release: The act of freeing substrate and chip from surrounding webbing,usually by breaking bridges. Partial, or intermediate release refers tobridge removal prior to freeing the final part from webbing(singulation).

Plies: Individual material layers in a μMECS™ laminate composite.

Lamination: Substantially permanent bonding of μMECS™ plies. Usuallylamination occurs under heat and/or pressure to cure an adhesive.

Sub-laminate: A laminate that is not a final μMECS™ product, but will besubsequently bonded to additional plies to form the final laminate.

Linkage: Laminate A laminate or sub-laminate that contains flexurehinges and rigid links.

Spacer: Generically, spacers are any plies within a μMECS™ laminate thatdo not contain flexures and are not adhesive. Spacers can serve manyfunctions but three examples are: rigid mechanical ground, to set adistance between two linkage laminates (i.e. as part of the rigid linkswithin a traditional kinematic linkage), or kinematic mounts forsub-components.

Adhesive Plies: Adhesive plies within μMECS™ laminate genericallydescribe adhesive connecting linkages and spacers. Adhesive is typicallyuniquely patterned for selective adhesion between sub-laminates, and istherefore considered a ply; this is not typical within standardcomposites manufacturing.

The following description is provided to enable any person skilled inthe art to make and use the disclosed inventions and sets forth the bestmodes presently contemplated by the inventors of carrying out theirinventions. In the following description, for purposes of explanation,numerous specific details are set forth in order to provide a thoroughunderstanding of the present invention. It will be apparent, however, toone skilled in the art that the present invention may be practicedwithout these specific details. In other instances, well-knownstructures and devices are shown in block diagram form in order to avoidunnecessarily obscuring the substance disclosed. These and otheradvantages and features of the invention will be more readily understoodin relation to the following detailed description of the invention,which is provided in conjunction with the accompanying drawings.

It should be noted that, while the various figures show respectiveaspects of the invention, no one figure is intended to show the entireinvention. Rather, the figures together illustrate the invention in itsvarious aspects and principles. As such, it should not be presumed thatany particular figure is exclusively related to a discrete aspect orspecies of the invention. To the contrary, one of skill in the art wouldappreciate that the figures taken together reflect various embodimentsexemplifying the invention.

Correspondingly, referenced throughout the specification to “oneembodiment” or “an embodiment” means that a particular feature,structure, or characteristic described in connection with the embodimentis included in at least one embodiment of the present invention. Thus,the appearance of the phrases “in one embodiment” or “in an embodiment”in various places throughout the specification are not necessarily allreferring to the same embodiment. Furthermore, the particular features,structures, or characteristics may be combined in any suitable manner inone or more embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows, in flowchart form, certain aspects of a prototype scaleprocess according to principles of the invention;

FIG. 2A shows, in schematic perspective view elements of a deviceprepared according to principles of the invention in an un-laminatedstate;

FIG. 2B shows, in schematic perspective view, a device similar to thatof FIG. 2A in a completed state;

FIG. 3A shows a printed circuit manufacturing line illustrative ofequipment that will optionally be employed in practicing certain aspectsof the present invention;

FIG. 3B shows a horizontal conveyorized printed circuit manufacturingstation illustrative of certain equipment that will optionally beemployed in practicing certain aspects of the present invention;

FIG. 4A shows, in schematic plan view, a portion of a layer or plyprepared to be included in a device prepared according to principles ofthe invention;

FIG. 4B shows, in schematic side view, certain aspects of amanufacturing process and manufacturing equipment according toprinciples of the invention;

FIG. 5 shows, in flow diagram form, a portion of an exemplary photopatterning method according to principles of the invention;

FIG. 6 shows, in schematic cross-section certain states of a ply duringa process according to the invention;

FIG. 7 illustrates, in flow diagram form, a method for delayed adhesivecuring according to principles of the invention;

FIG. 8 illustrates, in flow diagram form, a method for a two passthermal snap adhesive cure according to principles of the invention;

FIG. 9 illustrates, in flow diagram form, method for employing hybridcure adhesives according to principles of the invention;

FIG. 10 illustrates, in flow diagram form, certain aspects of a methodaccording to principles of the invention;

FIG. 11 illustrates, in flow diagram form, further aspects of a methodaccording to principles of the invention;

FIG. 12 illustrates, in flow diagram form, still additional aspects of amethod according to principles of the invention;

FIG. 13 illustrates, in flow diagram form, yet other aspects of a methodaccording to principles of the invention;

FIG. 14 illustrates, in flow diagram form, certain additional aspects ofa method according to principles of the invention;

FIG. 15 illustrates, in flow diagram form, still more aspects of amethod according to principles of the invention;

FIG. 16 illustrates, in flow diagram form, other novel aspects of amethod according to principles of the invention;

FIG. 17 illustrates, in schematic perspective view, certain aspects ofan electro-mechanical device prepared by a method according toprinciples of the invention;

FIG. 18 illustrates, in schematic cross-section, certain additionalaspects of an electro-mechanical device prepared by a method accordingto principles of the invention;

FIG. 19 illustrates, in flow diagram form, certain further aspects of amanufacturing method according to principles of the invention;

FIGS. 20A-20D illustrate, in flow diagram form, a manufacturing processfor manufacturing μMECS™ electromechanical device prepared according toprinciples of the invention;

FIGS. 21A-21B illustrate, in schematic cross-section, respectiveoperational states of an electro-mechanical device prepared by a methodaccording to principles of the invention;

FIGS. 22A-22B illustrate, in schematic cross-section and schematicperspective view, respective operational states of anotherelectro-mechanical device prepared by a method according to principlesof the invention;

FIG. 23A illustrates, in schematic cross-section, respective operationalstates of a substantially conventional mechanical device;

FIGS. 23B-23C illustrate, in schematic cross-section, respectiveembodiments of electro-mechanical devices prepared by a method accordingto principles of the invention;

FIGS. 24 and 24B illustrate, in schematic cross-section, respectiveoperational states of substantially conventional devices and contrastingelectro-mechanical devices prepared by a method according to principlesof the invention;

FIG. 25 illustrates, in schematic cross-section, certain aspects of anelectro-mechanical device prepared by a method according to principlesof the invention;

FIGS. 26A and 26B illustrate, shows in schematic cross-section, certainrespective aspects and operational states of an electro-mechanicaldevice prepared by a method according to principles of the invention;

FIG. 27 illustrates, in schematic cross-section, certain aspects of afurther electro-mechanical device prepared by a method according toprinciples of the invention;

DETAILED DESCRIPTION

The following description is provided to enable any person skilled inthe art to make and use the disclosed inventions and sets forth the bestmodes presently contemplated by the inventors of carrying out theirinventions. In the following description, for purposes of explanation,numerous specific details are set forth in order to provide a thoroughunderstanding of the present invention. It will be apparent, however, toone skilled in the art that the present invention may be practicedwithout these specific details. In other instances, well-knownstructures and devices are shown in block diagram form in order to avoidunnecessarily obscuring the substance disclosed.

FIG. 1 shows a block diagram corresponding to certain steps of ageneralized manufacturing process 100 for manufacturing a μMECS™ device.Beginning at step 102, the process involves forming a pattern in one ormore generally planar sheets of a more or less rigid material. In atypical application, at least one of the sheets will be substantiallyrigid. In certain applications, the generally rigid material may have ananisotropic characteristic such that it is more or less rigid along oneaxis than along another.

In various applications, the sheet will include a material such as, forexample, fiberglass reinforced polyester, carbon reinforced polyester,or any other filled or reinforced polymer material. Alternately or incombination, the generally rigid material may include a metallicmaterial such any appropriate metal or metallic alloy. The forming of apattern in such a sheet of material will include, in certain exemplaryapplications, the removal of material by photolithographic etching, theremoval of material by laser machining, patterning of the material bythe application of a die and/or the removal of material by theapplication of a cutting tool. In addition, additive processes may beused in forming the patterned sheet.

At step 104, a pattern is formed in one or more sheets of a generallyplanar flexible component material. In various applications, thegenerally flexible material may be substantially flexible. In certainapplications, the flexible material may have an anisotropiccharacteristic such that it is more or less flexible along one axis thanalong another. Patterning of the generally flexible material willproceed in any manner appropriate to the material including, amongothers, any of the processes identified above with respect to the rigidmaterial.

At step 106, a pattern is formed in one or more sheets of an adhesivecomponent material. In various cases, the adhesive material may besubstantially flexible. In other cases, the adhesive material will besubstantially rigid. In certain cases, the adhesive material may have ananisotropic characteristic such that it is more or less flexible orrigid along one axis than along another. Patterning of the adhesivematerial will proceed in any manner appropriate to the adhesive materialincluding, among others, any of the processes identified above withrespect to the rigid and flexible materials.

As indicated at step 110, fixturing apparatus is provided for alignmentof the various sheets of rigid, flexible and adhesive material preparedin steps 104-108. In certain embodiments, the fixturing apparatus willinclude alignment pins such as are known in the art. In otherembodiments the fixturing apparatus will include active alignmentactuators and/or optical alignment devices.

As indicated in step 112, an assembly is thereafter prepared by applyingthe previously prepared and patterned (and in some cases unpatternedsheets of material) to the fixturing apparatus. It will be appreciatedthat the patterns and materials will, in certain embodiments, differfrom sheet to sheet according to the requirements of a particularapplication. Moreover, in certain cases, one or more sheets of adhesivematerial may be omitted in favor of applying adhesive individual sheetsand/or surface regions. The adhesive material will be applied, in anymanner that is, or becomes, known in the art. By way of example only,the adhesive material may be applied in liquid, powder, aerosol orgaseous form as individual sheets are added to the assembly.

As will be understood by one of ordinary skill in the art in light ofthe totality of the current presentation, the characteristics of thevarious layers and patterns will be chosen and applied according to therequirements of a particular assembly being prepared. Thus, for example,where a joint feature is required, a prepared void in substantiallyrigid sheets above and below a flexible layer will leave a portion of anintervening flexible layer exposed and ultimately able to flexiblysupport the adjacent more rigid materials.

As indicated in step 114, curing conditions are then applied to theassembled materials and/or fixturing apparatus. In certain embodiments,the curing conditions will include the application of heat and/orpressure to the assembly of layers. In other embodiments, the curingconditions will include the application of physical or chemicaladditives such as, for example, catalytic chemicals, reducetemperatures, gaseous chemical components, or any other conditionappropriate to secure a desirable unification of the various layers intoan integrated assembly.

As per step 116, the integrated assembly is, in certain embodiments,then removed from the fixturing apparatus. In some embodiments theintegrated assembly is transferred thereafter to additional fixturingequipment. In other embodiments, and as will be understood by one ofskill in the art, the integrated assembly remains on the fixturingapparatus for further processing.

In step 118, a method according to certain embodiments of the inventionwill include the removal of certain portions of one or more of the rigidand/or flexible layers. These portions will have served to supportparticular regions of the corresponding layer during the precedingprocessing steps. Their removal will allow one or more of those portionsto translate, rotate, or otherwise reorient with respect to someadditional portion of the assembly. This step may include the removal ofindividual assemblies from a larger sheet/assembly on which multipleassemblies of similar or different configurations have been prepared.

In certain embodiments, the removal of particular support regions willbe effected by laser machining. In various other embodiments, theremoval of support regions will be effected by mechanical machining, wetchemical etching, chemical vapor etching, scribing, cutting, diecutting, punching, and/or tearing, among others. One of skill in the artwill appreciate that any combination of these methods (or other methodsthat are known or become known in the art) will be beneficially appliedand will fall within the scope of the invention.

Once the removal of identified portions of the one or more rigid and/orflexible layers is complete, the assembly is activated, as per step 120to transition from its existing status to a post-activationconfiguration. This activation will, in certain embodiments, includereorientation of certain portions of one or more regions of one or moreof the sheets of material. Thus, for example, in certain embodiments, aportion of the assembly will fold up out of its initial plane to form athree-dimensional assembly in the manner of a pop-up book.

The activation 120 will incorporate various motions in correspondingembodiments of the invention including various translations androtations along and about one or more axes. In respective embodiments,the activation will be effected by active fixturing apparatus, by theaction of an individual worker, by a robotic device, by a deviceintegrated within the assembly itself such as, for example, a spring, amotor, a piezoelectric actuator, a bimetal/bimorph device, a magneticactuator, electromagnetic actuator, a thermal expansive or contractivedevice, a chemical reaction including, for example, a gas generatingprocess, a crystallization process, a dehydration process, apolymerization process, or any other processor device appropriate to therequirements of a particular application.

In certain embodiments, and as indicated at step 122, a further processstep will secure the apparatus in its activated configuration. Amongother methods that will be evident to one of skill in the art in lightof the present disclosure, this step of securing the apparatus in itsactivated configuration will include, in certain embodiments, pointsoldering, wave soldering, tip soldering, wire bonding, electricalwelding, laser welding, ultrasonic welding, thermal bonding, chemicaladhesive bonding, the activation of a ratchet and pawl device, theactivation of a helical unidirectional gripping device, the applicationof a snap, a hook and loop fastener, a rivet, or any other fastener orfastening method that is known or becomes known to those of skill in theart.

Of course it will be understood by the reader that in certainembodiments, the process or mechanism that reorients the apparatus intoits activated configuration will serve to maintain that configurationwithout any additional step 122 process or action. Moreover, while thesecuring indicated at step 122 is generally anticipated to be permanent,in certain applications it will be beneficially temporary and/orrepeatable.

At step 124 additional scaffolding elements will be removed or severedto release the activated and secured μMECS™ device from any remainingscaffolding. One of skill in the art will appreciate that this step willbe unnecessary where the device was completely released from anyassociated scaffolding prior to activation. Moreover, in otherembodiments and applications the activated device will remain coupled tosurrounding scaffolding for additional processing steps. To the extentthat step 124 is applied any of the approaches and methodologiesidentified above at, for example, step 118 will be advantageouslyapplied according to the instant circumstances.

Thereafter, again depending on the requirements of a particularapparatus or embodiment, various testing, packaging, systems integrationand other manufacturing or application steps will be applied asindicated in step 126 after which the operation concludes with step 128.

FIG. 2A shows certain elements 200 of an assembly consistent with, forexample, process 100. The elements include a first patternedsubstantially rigid layer 202, a second patterned substantially rigidlayer 204, a patterned substantially flexible layer 206, and first 208and second 210 patterned adhesive layers.

As shown, the pattern of each exemplary layer includes apertures, e.g.,212, 214 for receiving corresponding fixturing pins or dowels, e.g.,216, 218. These fixturing dowels serve to maintain a desirable alignmentof the various patterns while the assembly is compressed and curing ofthe adhesive layers 208, 210 is accomplished.

The result, as shown 230 in FIG. 2B is an exemplary hinged assembly 232that has been released from a surrounding scaffolding material 234 bythe severing of various support regions, e.g., 236. As is readilyapparent the released assembly includes a hinge feature 238 coupledbetween first 240 and second 242 substantially rigid members. As furthershown in the magnified portion region 244, each substantially rigidmember includes an upper rigid portion 246 and a lower rigid portion 248coupled to respective sides of the flexible portion 250 by respectivelayers of cured, or otherwise activated, adhesive material 252, 254. Itwill be further appreciated that, while no securing step is apparent inrelation to the hinged assembly 232, other assemblies will benefit fromsuch further processing.

According to principles of the present invention, μMECS components canbe fabricated in-line, one component at a time, or in batches. Whenusing parallel processes (e.g. etching), manufacturers should fit asmany components as possible onto a single panel to minimize unit costand improve throughput. For example, 600×600 or 1200×1200 are used inlow volume production, however panel size should be chosen based onequipment capabilities, throughput, and required tolerances.

FIG. 3A shows, for example, an automated vertical wet processing system300 for the processing of printed circuit boards. The system includes aplurality of individual chemical processing and rinse tanks, e.g., 302,304, 306. Robotic equipment, e.g. 308,310 can be applied to movesubstrate materials and subassemblies between the various processing andrinse tanks to effect desired etching steps, such as those furtherdescribed below. Typically, the work in process materials will betemporarily coupled to machine racks that are effective to readilyinterface with the robotic equipment 308, 310 and suspend the work inprocess material within the tanks.

FIG. 3B shows an alternative style of processing equipment 350 in whichwork in process materials are conveyed through a processing chamber 352while supported from below by a conveyor belt 354. Processing chemicalsand rinses are applied by, e.g., spraying from above as the work inprocess material passes through a series of such stations. Again thework in process will, in particular embodiments of the invention,include individual plies of μMECS™ material and/or multi-layersubassemblies.

FIG. 4A illustrates, in schematic plan view, a portion of a μMECS™component ply 400 prepared according to principles of the invention. Incertain embodiments, the ply 400 will include a material such as, forexample, a stainless steel material, a spring steel material, a metallicalloy material, or any other material desirable in a particularapplication of the invention.

After etching in any high-volume process of the current invention, theply will include land areas, e.g. 402, 404, 406 and scaffolding regions408. Apertures, e.g. 410, 412 are defined by respective edges of theland areas, e.g. 416, 418, 420.

In certain embodiments of the invention, bridge material, e.g. 422, 424will be temporarily left in place between respective land areas and/orland areas and scaffolding regions. It will be appreciated by one ofskill in the art, that these bridge materials will be removed duringlater processing. As will be further described below, in otherembodiments of the invention, the desired ply material 400 will bepre-laminated with a sacrificial layer of, for example, a polymermaterial. Consequently, no bridge material will be left in place.Instead, the sacrificial layer will be, e.g., dissolved, evaporated orburned away during later processing.

It will be understood that the application of automated vertical andhorizontal chemical processing, according to principles of theinvention, will allow the production of high-quality layers andsubassemblies at substantially higher throughputs and, ultimately, lowerper part cost as compared with laser etching. The resulting economicefficiencies will allow the application of μMECS™ manufacturingtechniques to produce wide variety of consumer and industrial componentsand devices.

Adhesive patterning and cure time are the primary targets for increasedμMECS production throughput. As a high throughput alternative tolaser-cutting B-staged film, adhesive can be patterned during depositionon plies or sub-laminates. Various high volume adhesive depositionmethods are described below: Screen/Stencil Printing As demonstrated inelectronics assembly, adhesives of many cure types (e.g. light, thermal,PSA) can be screen/stencil printed. Generally, screen printableadhesives are high viscosity and thixotropic liquids or pastes.Screen/stencil printing is successfully implemented in precision, highvolume applications such as flip chip packaging, die attach, solarcells, and MEMS packaging with demonstrated trace and space down to 101Lm/101 Lm.

A fine stainless steel mesh >325 with thin emulsion can achieve fineline, thin bond line (<1 mil) results. For high throughput μMECS,automated screen printers used in electronics assembly can coat eachpanel in seconds in an automated assembly line. Example adhesives forthin bond line, fine line screen printing include DUALBOND OB787 (DELO),H70 line of epoxies (Epoxy Technol-ogy), and Ablebond 8387 (Henkel). Forliquid and paste adhesives, bond line can be difficult to control in alaminate.

According to principles of the invention, high-volume production can beachieved in part by the application of adhesive patterning technologiesincluding adhesive jet printing, diecut adhesive film, adhesive transferprinting, adhesive spraying, and the application of adhesive B-stagingalong with any of these technologies.

Adhesive patterns can be printed using high speed jet dispensing, forexample ink jet. Example hardware is the Nordson ASYMTEK DispenseJetDJ-9500 or DELO-DOT PN2, capable of dispensing adhesive down to 1501 Lmdots at 300 Hz. Complex adhesive geometries with thin bond line can beachieved by depositing dot patterns with predictable flow whencompressed. Bond line can be maintained using the Bond Line Controlprocesses below.

A common technique for substrate die attach, B-staged epoxy or acrylicadhesives are die-cut from adhesive carrier and placed at preciselocations onto a substrate. Die cutting is a possible application forμMECS components with adhesive patterns containing simple, repeatableshapes. Die cutting can be combined with higher precision methods (e.g.laser machining) to achieve high throughput and small features. Anexample adhesive film is ESP7670-WL (AI Technology Inc.), which isthermally cured in, for example, under 10 minutes.

Transfer printing employs an etched or engraved plate to pick up andtransfer a pattern of adhesive to substrate. Processes to transferadhesive patterns to μMECS™ plies include rotogravure, flexographicprinting, stamping, pad printing, or any other process to physicallytransfer a pattern of liquid adhesive to a ply.

Spraying is a further process for rapid deposition of thin adhesivecoats on patterned plies. In general, spraying is used to coat an entireply with adhesive in under 5 seconds. A variety of liquid adhesives canbe sprayed (e.g. epoxies or acrylics), including B-stageable materials.

FIG. 4B illustrates, in schematic elevation, the application of anexemplary spray deposition process 450 according to principles of theinvention. As shown, a previously etched component ply 452 is supportedfor processing on, for example, a conveyor or table 454. In certainembodiments, and as illustrated, the conveyor or table 454 will includea screen or textile material having members arranged longitudinally,e.g. 456 and transversely 458 to a longitudinal axis 460 of a processingstation. In this arrangement, apertures 462 are present between thetextile members. A spray nozzle 464 is disposed, for example, above thecomponent ply 452.

As illustrated, uncured adhesive material 466 is sprayed towards andonto the component ply 452. The adhesive material 466 will self patternon the component ply 452, forming a layer of adhesive 468 on the landareas of the component ply and passing through 470 apertures 472 of thecomponent ply 452. The resulting layer of adhesive 468 may thereafter beimmediately placed in contact with further component plies, be allowedto dry by evaporation of a solvent and/or be B-cured for laterprocessing.

Excess adhesive material 466, 470 having passed through apertures 472 ofthe component ply, 472 is collected 474 for disposal and/orrecirculation.

In certain embodiments of the invention, the conveyor or table 454 willadvance 476 to move the component ply material 452 past the spray nozzle464 to ensure distribution of the adhesive material in an even layer 468on the component ply 452. In other embodiments of the invention, thespray nozzle 464 will be mobile, and moved 478 to achieve this end. Incertain other embodiments of the invention, both the spray nozzle 464and the conveyor or table 454 will move.

It will be appreciated by one of skill in the art that multiple spraynozzles will, in certain embodiments, be employed in parallel and, thatin certain embodiments multi-component adhesives will be sprayed througha single nozzle and/or through discrete respective nozzles. In addition,in certain embodiments, inkjet spray nozzles will be employed such thatrastering of the spray nozzle and/or the supporting conveyor or tablewill allow specific patterning of the adhesive layer 468.

Selective adhesion can be achieved using a physical shadow maskregistered to a machined ply. Masks are not required for linkage orspacer laminate plies when adhesive pattern is identical to adjoinedply. In this case, the ply acts as a mask by collecting only on itssurface with minimal deposition on sidewall or across holes. Exemplaryresults are obtained by depositing 3-25 μm B-stageable epoxy using anultrasonic sprayer (e.g., Ultrasonic Systems Inc.) on steel andpolyimide substrates.

FIG. 5 shows, in flow diagram form, a portion of an exemplary method 500of photo-patterning of adhesive on a substrate ply or sub-laminate.According to the illustrated method, a hybrid adhesive (i.e. two curemechanisms) is photo-lithographically patterned then cured using asecond mechanism. An example is a hybrid UV/thermal cure adhesive.

The Photo-Patterning process is analogous to photolithography steps inMEMS or PCB fabrication. Example commercial adhesives in MEMS includeBCB and SU-8, however these materials may not be optimal for μMECS™materials such as stainless steel and Kapton. Accordingly, in certainembodiments, a custom formulated adhesive will be applied in practice ofthe invention. In certain embodiments, a photo-patterned adhesiveprocess according to principles of the invention, enables smallline/space (2 mil/2 mil) using existing PCB and flex circuit processingequipment.

FIG. 6 shows, in schematic cross-section, certain states 600 of a ply orsub-laminate 602 during, for example, the method 500 of FIG. 5.Referring now to both FIG. 5 and FIG. 6, a first ply or sub-laminate 602is provided 502 for processing.

The first ply or sub-laminate 602 is shown in FIG. 6 as having landareas, e.g., 604 and apertures, e.g., 606. As will be apparent from FIG.6, and from the discussion above with respect to FIG. 4B, adhesivecoating of the land areas by liquid, or solid (particulate spray, sheet,gel) methods will be employed according to the requirements of aparticular volume manufacturing application. Thus, in the illustratedembodiment, the method 500 includes depositing (e.g. spray, dip, blade,unroll, etc.) 504 the liquid or sheet adhesive onto a firstply.

Where a liquid adhesive is employed, after application it is soft baked506 to remove solvent, drying and immobilizing it for processing.Depending 508 on the requirements of a particular application, a maskwill be applied 510 to pattern the adhesive. Thereafter, the uncuredadhesive not covered by the mask is exposed to ultraviolet light 512 toactivate the first stage cure mechanism, affixing but not fully curingon a ply (B-stage). A photo-tool, or mask is used to selectively B-stagecertain regions of adhesive that remain in the laminate. It will beappreciated by one of skill in the art that negative cure adhesives andnegative mass will also be beneficially applied in certaincircumstances, in which case exposed adhesive will remain uncured whilemasked adhesive will cure.

Thereafter, uncured adhesive is removed by solvent or developer strip514, without damaging B-staged adhesive. Next, a second ply isregistered 516 and, thereafter, cured with heat 518 (i.e, by convective,conductive and/or radiative heating). Finally, the fully cured assemblyis removed 520 for inspection, packaging and/or further processing.

With reference now to FIG. 6 it will be noted that apertures 608 in theply 602 may be temporarily filled prior to the application of adhesive,by fixturing and/or a removable filler such as wax and/or polymermaterial, where appropriate to the requirements of a particularembodiment. This temporary filler may later be removed physically,and/or by chemical dissolution, thermal melting, burning, etc.

Thereafter, a layer of adhesive 610 is applied to the first ply orsub-laminate 602. Where a liquid adhesive is employed, after applicationit is soft baked 612 to remove solvent, drying and immobilizing theadhesive layer 614 for processing.

Depending on the requirements of a particular application, a mask willbe applied 616 to pattern the adhesive. In certain embodiments, the maskwill include a single layer of material regions that are, respectively,opaque 618 and transparent 622 the curing wavelengths. In otherembodiments (and as illustrated), a layer of opaque material 622 will besupported by a layer of transparent material 624.

Once masked, the uncured adhesive not covered by the mask e.g., 626 isexposed to curing radiation such as, for example, ultraviolet light 628.This exposure is continued with a duration and/or intensity sufficientto activate the first stage cure mechanism, affixing but not fullycuring (B-stage) the adhesive 610.

Thereafter, the mask is removed 630 and uncured adhesive 632 is removedfrom the ply or sub-laminate 602 by solvent or developer strip 514,without damaging B-staged adhesive. The result is a patterned B-stagedadhesive 634 disposed at respective surface areas 636 of the ply orsub-laminate 602.

Either immediately, or after inspection and/or storage, a further ply637 and/or component and/or sub-laminate is registered 516 and,thereafter, cured, e.g., with heat 638 (i.e, by convective, conductiveand/or radiative heating), by the application of a chemical catalyst, orother means. Finally, the fully cured assembly is removed 640inspection, packaging and/or further processing.

Liquid or paste adhesives deposited by inkjet or screen print havedifficult to control bond lines. Several techniques are available thatmaintain a thin, controlled bond line to meet the requirements of thepresent invention. These include, among others, the incorporation ofsolid particles, such as those found in electrically or thermallyconductive adhesives; the use of a rigid sheet of material of therequired bond line thickness between plies; and a two-step adhesiveprinting process, wherein a first layer of adhesive is deposited andcured to create a separation between plies during the second adhesivecure step.

A further novel and beneficial improvement includes the application ofrapid curing adhesives in high-volume manufacturing of μMECS™ componentsand systems. Whereas state of the art μMECS™ prototyping requires 30minutes tack bond and 5 hour cure per lamination, the cycle times arenot compatible with high-volume production methods according to thepresent invention. One exemplary high-volume product would require fourlamination cycles during production, or 22 hours in a press; a majorbottleneck to high volume production.

Advantageously, a method according to the invention includes thesimultaneous lamination of multiple panels and, thereafter, rapidcooling in a second press, freeing the heated press to conduct furtherprocessing during the cooling stage of already-heated work in processmaterials.

In a further embodiment of the invention, plies and/or sub-laminatesand/or components are combined using a Pyralux™ adhesive; data sheetssuggest 5 minutes at 250° C. is sufficient. It should be noted that thissolution requires prohibitively high temperature for certain materials,and comes at the cost of increased laminate stresses.

High throughput adhesives, particularly used in electronics assembly,are alternatives to the slow B-staged Pyralux material. A wide range ofadhesives are compatible with μMECS, and a universal solution doesn'texist for all applications and materials. Careful consideration ofsubstrate material compatibility, required throughput, depositionmethod, cured adhesive properties (e.g. Young's modulus, peel strength,bond line, feature size), and cost are required for μMECS adhesiveselection. Example embodiments are presented here in the context ofbuilding the THC, a stainless steel and polyimide construction.

Light curing adhesives Light (or radiation) cure adhesives are activatedby UV or visible light and have full cure times on the order of seconds,some lower than Is. Light curing adhesives are typically singlecomponent with a long shelf life, making handling and storage easy. Manylight cure adhesives are manufactured for high volume electronicsassembly by major adhesive companies such as Henkel and 3M. Althoughheat will speed up cure reactions, light activated adhesives can cure atroom temperature, eliminating thermal mismatch and enabling a wide rangeof materials in μMECS™ components. Light curing adhesives generally havea faster processing time than thermal, however selection should alsoconsider material ply compatibility, cost, desired throughput, printingmethod, and cured mechanical properties.

A solution for opaque μMECS laminates is a pre-activated light curingadhesive. Pre-activated adhesives have a delayed curing mechanism; theadhesive has a working time of several seconds after light exposure,during which the two materials can be registered and joined. One exampleadhesive is a delayed cure cationic such as KATIOBOND 4595 (DELO).

FIG. 7 illustrates, in flow diagram form, a method or process 700 fordelayed UV/visible light curing adhesive beneficially applied in certainembodiments the present invention. According to method 700, effectiveresults will be achieved by screen printing 702 KATIOBOND 4595 (DELO)onto a μMECS™ linkage laminate. The printed pattern places adhesive onlyin areas required for selective adhesion to another laminate.Thereafter, expose 704 the epoxy to 460 nm wavelength light (55 mW/cm2intensity for 5 s) to pre-activate the curing mechanism. Thereafter,optically register 706 a second laminate to the first using visionrecognition of fiducials on both laminates. Preferably, registrationwill happen within the 18 s open time of the KATIOBOND 4595, or thecorresponding open time of an alternative adhesive. Thereafter, apply708 very light pressure (<5 PSI) to affix the two laminates while theadhesive cures.

The bonded laminates are strong enough for further processing 710 (e.g.subsequent release and lamination cycles), however the adhesive willreach full strength 712 within 24 hours at room temperature.

Thermal snap cure adhesives are formulated for high volume electronicsassembly and can come as a one or two part printable liquid or paste, ora B-staged film. Additionally, adhesives can be printed directly onto alaminate and B-staged for later processing. To bond plies with thermalcure adhesive, heat can be applied by convection oven (e.g. batch ortunnel oven), direct contact (e.g. press, heated stamps, or thermodes),induction (for electrically conductive plies), and infrared radiators.Setting time for snap cure adhesives can be lower than 1 minute,allowing fast panel lamination and release cycles. For some adhesives, athermal post-cure will be required to reach full strength, which can beprocessed in large batches.

Adhesive selection criteria includes pattern de-position method (e.g.screen, jet), compatibility with ply materials, throughput requirements,and cured mechanical properties (e.g. Young's Modulus, shear strength,and bond line). Example adhesives include H70E-4, H70E, and H74 epoxies(Epoxy Technology), DE-LOMONOPOX MK055 (DELO), and ABLE-BOND 83878(Henkel).

FIG. 8 illustrates, in flow diagram form, a method or process 800 for atwo-pass thermal snap cure μMECS™ process. According to method 800,effective results will be achieved by screen printing 802 1 milDELOMONOPOX MK055 (or equivalent) adhesive paste on top of a μMECS™linkage laminate. Thereafter, register 804 a second linkage laminateusing dowel pins through interference fit holes in the laminates; bringthe two laminates in contact 806. Thereafter, directly apply heat 808(200° C.) using a heated stamp to the top substrate for 6 s to snap curethe adhesive. The resulting laminate can undergo further processing(e.g. intermediate release and subsequent lamination) or final release.

FIG. 9 illustrates, in flow diagram form, a method or process 900 forthe application of hybrid cure adhesives in a μMECS™ process. Designedfor applications with bond regions shadowed from light, hybrid cureadhesives can be activated with UV/visible light to bond transparentsubstrates or an exposed adhesive fillet. Final cure strength isachieved by a thermal cure. In μMECS, the edges of a bonded laminate canbe light-cured to establish bond strength for additional processing(e.g. release and subsequent lamination). Once all process steps arecomplete, an entire laminate can be thermally cured for full bondstrength.

According to method 900, effective results will be achieved by screenprinting 902 1 mil hybrid UV/thermal cure adhesive (e.g. DELO DUALBONDOB787 or equivalent) onto a μMECS linkage sub-laminate. Thereafter,register 904 a second linkage sub-laminate using dowel pins throughinterference fit holes in the laminates. Thereafter, bring the twolaminates in contact 906. Subsequently, expose 908 to 55 mW/cm2 355 nmUV light for 9 seconds, curing the adhesive exposed around edges.Thereafter, continue processing 910 the new laminate (e.g. release,subsequent lamination, or component pick and place). Oven cure 912 theshadowed adhesive at 150 C for 10 minutes. A large batch of panels canbe simultaneously cured.

Alternative cure mechanisms, according to principles of the invention,with μMECS™ applications include humidity cure and anaerobic cure, andcombinations of any of the foregoing. In addition, hybrid cure adhesiveshave application in sub-component assembly, especially electromagneticor other actuation components. B-staged adhesive A modified version ofthe thermal snap or radiation cure adhesives. Adhesive is printeddirectly onto linkage or spacer sub-laminates during their fabrication.The adhesive is B-staged, forming a dry, immobile, film that can behandled or processed later. B-staging can occur by one of severalmechanisms, including solvent evaporation or first stage (for a hybridadhesive) cure. B-staging printed adhesives provides several advantagesfor storage, handling, and processing. First, adhesive deposition andprinting can occur at a separate facility, or at a separate time fromthe multilayer lamination and cure step. Additionally, B-staged materialcan have highly controllable bond line and be of higher molecular weight(more advanced cure), reducing flow.

FIG. 10 illustrates, in flow diagram form, a method or process 1000 foran exemplary B-stage adhesive process for μMECS™. According to method1000, effective results will be achieved by fabricating 1002 a linkageor spacer sub-laminate. Thereafter, screen printing 1004 adhesive ontothe constructed laminate. Thereafter, B-staging the adhesive 1006 byevaporating solvent, forming a 25μ dry film that will not cure or damagewhen subjected to shipping, handling, or storage conditions; andthereafter shipping 1008 the sub-laminate and adhesive for assembly at aseparate facility.

Pressure Sensitive Adhesives (PSAs) are commonly used in high throughputlamination applications. Liquid precursors can be printed on liner ordirectly on substrate, then dried or UV cured in-line to form a tackysurface; die cutting or digital (laser) converting transfer tape is alsofeasible. Second substrate can then be registered and cured with briefapplication of pressure. Thin bond line (0.001″) and fine features(<0.006″) are possible with PSAs. Downsides to PSAs include loweradhesive strength, high temperature resistance, and mobility afterplacement. However, their fast, low cost processing makes them acandidate for some μMECS applications.

The present invention includes systems and methods for reducingmanufacturing time including reducing the time required for release ofcompleted components from surrounding scaffolding structure. Prototypeproduction of the μMECS™ THC release uses a 20 W 355 nm UV laser todrill individual bridges that retain sub-strate to webbing. Laserdrilling is applicable to vol-ume production, and widely used in rigidand flexible PCB manufacture for via drilling, routing, and depaneling.The appropriate laser technology will depend on materials and featuresize, however UV, IR, and CO2 lasers are broadly applicable.Alternatives to laser release include die cutting and routing, alsocommonly used in PCB manufacturing.

Release process time is dominated by thick, poor machinability materialslike stainless steel. In pro-duction, specialized tools are required forhigh throughput release of rigid materials. The Stencil-Laser G6080(LPKF), for example can machine up to 800 stainless steel bridges perminute using a $200 k system. For a complex, high throughput componentlike THC (450 bridges per part), each laser is only capable of 1-2 PPMthroughput. In addition, the specialized IR laser thermally damages mostother materials like polyimide and adhesive.

It's advantageous to minimize or eliminate rigid material bridges bysubstituting a more machinable material. Several solutions exist forlinkage and spacer laminates that enable release to thousands of bridgesper minute. For example, in certain embodiments and applications, it isadvantageous to machine individual plies on a sacrificial film carrier.Each μMECS ply, laminated to a sacrificial film, can be selectivelyetched to pattern substrate and chip islands. The film carrier isremoved or decomposed. The following represent materials advantageouslyemployed in various embodiments of the invention.

-   -   A) Soluble films. For example polyvinyl alcohol (water-soluble),        MEMS wafer processing films (isopropynol-soluble), and dry film        photoresist (developer-soluble). These films can be batch        dissolved after lamination.    -   B) Thermally decomposing films. For example thermoset plastics        that degrade during or after lamination.    -   C) Melting films. For example hot melts or wax that melts during        or after lamination.    -   D) Biodegradable films. For example biodegradable PET.        Degradation is slow, however can be accelerated with external        mechanisms such as water or heat.

Linkage laminates are an important element of many μMECS™ components,and include of rigid links and flexure hinges. Exemplary compositelaminate construction includes at least two rigid material pliessandwiching one flexible material ply, and hinges are nominally createdusing the process described above with respect to FIG. 1.

The material-independent composite layup of a linkage laminate is:[Rigid/Adhesive/Flexure/Adhesive/Rigid], however adhesivelessconstructions are also possible. An alternative construction includesjust one rigid layer bonded to one flexure layer, however designsincorporating this construction are susceptible to peel stressdelamination during flexure bending.

In certain aspects, the present invention includes methods for highvolume linkage laminate production. For example, one embodiment is astraightforward adaptation of the current prototype methods, howeverusing high-throughput processes and equipment. In this method, eachmaterial ply (two rigid, one flexible) is machined using an appropriateprocess for the material, thickness, features, tolerances, speed, andcost. Candidates include, but are not limited to, photochemicalmachining (etching), laser cutting, water-jet cutting, die cutting,electroforming, and electrical discharge machining (EDM).

Like printed circuits, μMECS™ planar features can be evaluated by ‘traceand space’, a linear dimension that represents the smallest physicalfeatures and smallest holes that can be machined. THC, for example,requires trace/space as small as 8 mil/2 mil in linkage laminates.Chemical etching is a strong candidate for THC's thin gauge stainlesssteel and polyimide construction. Etching has an added benefit ofminimal post-processing time because there are no chads, burrs, ormachining stresses.

The Pre-Patterned Plies method uses an adhesive patterned prior tolamination, however is agnostic to selective adhesion process. Oneembodiment of the Pre-Patterned Plies method is illustrated in FIG. 11.

FIG. 11 shows, in flow diagram form, a method and process 1100 ofpreparing pre-patterned plies including wet etching 1102 two 0.002″ AISI304 full hard stainless steel (rigid) plies and one 0.001″ Kaptonpolyimide (flexure) ply with desired geometries. Thereafter, bothstainless steel plies are coated 1104 by spraying 0.0005″ thick (dry)B-staged epoxy using an ultrasonic sprayer (Ultrasonic Systems Inc).Plies are registered and retained by dowel pins 1106. Subsequently, the[Stainless/Epoxy/Kapton/Epoxy/Stainless] composite is laminated 1108under heat and pressure. Many linkage laminates can be laid up andpressed in parallel to increase throughput.

FIG. 12 shows, in flow diagram form, a further exemplary method andprocess 1200 that employs plies similar to those of method 1100.However, plies are laminated with an un-patterned adhesive, which ismachined after lamination by chemical etching, plasma etching, orthermal decomposition. The adhesive material can be applied in a uniformfilm, compatible with the material plies, and selectively removed afterlamination. Examples include but are not limited to: B-staged film(epoxy or acrylic), pressure sensitive adhesive (PSA), and thermoplastic(hot melt). In this method, the rigid pre-patterned plies can be used asa mask, or an additional mask can be applied (e.g. photoresist) toprotect the rigid plies from the adhesive removal process.

Process 1200 include the steps of wet etching 1202 two 0.002″ AISI 304full hard stainless steel (rigid) plies and one 0.001″ Kapton polyimide(flexure) ply with desired geometries. One of skill in the art willappreciate that the indicated ratios are intended to be multipliedaccording to the desired throughput of the process. The un-patternedadhesive doesn't require precise registration; oversized clearance holescan be punched into the adhesive, allowing dow the construction el pinpass-through. Accordingly, punch large clearance holes through adhesivesheet 1204. Thereafter, using 0.000500 thick DuPont Pyralux FR B-stagedfilm adhesive (a modified acrylic), lay up and laminate 1206 the[Stainless/Acrylic/Kapton/Acrylic/Stainless] composite under heat andpressure. Rigid and flex plies are registered and retained by dowel pins1208. Many linkage laminates can be laid up and pressed in parallel toincrease throughput. Thereafter, the laminated assembly is subjected toa 100% oxygen cold gas plasma 1210 (e.g. Plasma Etch BT-1) to etchexposed adhesive. The rigid stainless steel acts as a mask, protectingunderlying adhesive from etching. Etch power and duration should beprecisely controlled to prevent damage to the Kapton once adhesive hasbeen removed.

FIG. 13 illustrates, in flow diagram form, a still further aspect of theinvention in which two outer rigid plies are laminated to the centralflex ply before machining. The assembly can be adhesive based oradhesiveless, meaning rigid plies can be directly bonded to the flexmaterial. An example adhesiveless construction employs DuPont's PyraluxAC copper-clad Kapton. Each ply of the laminate is selectively machinedusing etching (chemical or dry) processes to form links and hinges.

A benefit of the pre-lamination method is the capability to patternunsupported islands of material in rigid plies. The islands are adheredand retained to webbing by the flex ply. The pre-laminated structureimproves release throughput and cost by eliminating rigid ply bridges;flex material can be machined faster and with lower energy.

With further reference to FIG. 13, for a stainless steel and Kaptonpolyimide linkage laminate an exemplary process 1300 includesconstructing 1302 the composite laminate:[Stainless/Epoxy/Kapton/Epoxy/Stainless] from 0.001500 AISI 304 fullhard stainless steel, 0.000500″ Kapton HN (DuPont), and 0.00100Hanwhaflex HGB-E500EG (Hanwha L&C) epoxy. Thereafter, mask 1304 andselectively photochemically machine (wet etch) 1306 the two stainlesssteel plies. Retained features are masked using a patterned, dry filmphotoresist. Each layer requires a separate phototool and must beregistered precisely during photoresist exposure; <0.0005″ registrationis achievable using state of the art PCB exposure equipment. Substrateand chips are adhered directly to Kapton and require no bridges towebbing. Photochemical etching industry standards can achieve 3 mil/3mil trace and space, with the possibility of smaller features dependingon required yield.

Subsequently, selectively wet etch 1308 the two epoxy pliessimultaneously. The resulting patterned features match those of thestainless steel; no undercutting is required. Features are masked usinga patterned, dry film photoresist. Each layer requires a separate maskand masks must be registered precisely during exposure.

Finally, selectively wet etch 1310 the Kapton polyimide, retainingflexure hinges and bridges. The Kapton will connect the entire μMECScomponent in webbing for later processing steps (e.g. lamination andrelease).

The High Density Interconnect (HDI) flex circuit is another specificembodiment of the Pre-Lamination Method. HDI technology is driven by thedemand for increased density in rigid and flexible PCBs, withtrace/space requirements lower than 30 jtm. In the HDI embodiment, asingle or double-sided flex circuit is used as the linkage laminate,with copper as the rigid layer. Flex material (base substrate ordielectric in PCB terminology) is chosen based on material propertiesand process conditions; commonly polyimide, polyester, and flourocarbonare used.

FIG. 14 shows, in flow diagram form, a further high-volume manufacturingmethod 1400 termed the Hybrid Machining Method. The Hybrid MachiningMethod enables fine, tight tolerance features with improved unit costand throughput over pre-machining methods. In general, Hybrid Machiningis applicable to μMECS linkage laminates with infrequent precisionfeatures. An example application is flexures with smaller and tightertolerance features than other planar features. In this case, precisionflexure pre-machining (e.g. by laser) can be combined with highthroughput methods (e.g. etching) for remaining features.

In this context, method 1400 includes using, for example, a 355 nm UVlaser with 10μ spot size to machine 1402 35μ×100μ flexure hinge gapsinto 0.00200 AISI 304 full hard stainless steel plies. Include fiducialsand dowel pin holes for realignment. Thereafter, laminate 1404 thestainless steel plies to a 0.000500 Kapton HN flex ply, forming the[Stainless/Epoxy/Kapton/Epoxy/Stainless] composite. Thereafter, apply1406 0.00100 Hanwhaflex HGB-E500EG (Hanwha L&C) for the epoxy.Thereafter, register 1408 the two steel layers using dowel pins. Itshould be noted, however, that the Kapton and adhesive require noalignment and can be punched with dowel pin clearance holes. Thereafter,selectively wet etch 1410 the remaining features in the two stainlesssteel plies. Retained features are masked using a patterned, dry filmphotoresist. Each layer requires a separate phototool and must beregistered to the pre-machined flexure gaps precisely during exposure.Only substrate and chip material is retained in the stainless steel;islands of material are bonded to Kapton. Thereafter, selectively wetetch 1412 the two epoxy plies simultaneously.

The patterned features match that of the stainless steel; noundercutting is required. Retained features are masked using apatterned, dry film photoresist. Each layer requires a separate mask andmasks must be registered precisely during exposure. Thereafter,selectively wet etch 1414 the Kapton polyimide, retaining flexure hingesand bridges. The Kapton will support the μMECS component in webbing forlater processing steps (e.g. lamination and release).

Spacers are generally rigid materials used to separate linkagesub-laminates or serve as mechanical ground in μMECS laminates. Commonexamples include patterned 0.002″-0.025″ polyimide or steel sheets. Ingeneral, spacers can be fabricated by any machining method (e.g. laser,die cut, waterjet, chemical etch, EDM, electroforming) appropriate forthe material, thickness, feature size, and tolerances.

Often, spacers require features smaller than the constraints imposed bymaterial thickness. In this case, spacers can be fabricated from manythin materials that are machined, stacked, and laminated to achieve thedesired thickness. An example is a 0.023″ stainless steel spacer withminimum slot size 0.006″. This high aspect ratio hole is difficult tomachine from stock. One solution is to chemically etch four 0.005″stainless sheets and adhere them with 0.001″ adhesive. In this case theadhesive pattern identically matches that of the spacer material, andcan be patterned using processes such as process 1200 or process 1300,for example, as described above.

Similar to linkage laminates, thick spacer bridges can be eliminated byusing the Pre-Lamination Method described in relation to process 1300above. However, a thin, machinable film or foil must be added to spacersin lieu of the flex ply in linkages. A consequence of the Pre-LaminatedSpacer in Carrier is a reduction in stiffness and yield strength at thethin carrier and adhesive interface. However, this method is suitablefor components subjected to relatively low forces.

FIG. 15 shows, in flow diagram form, exemplary process 1500 tofabricate, for example, a carrier-supported 0.006″ stainless steelspacer. Process 1500 includes laminating 1502 two 0.002″ AISI 304 FHstainless steel sheets to a 0.001″ Kapton HN polyimide film usingHanwhaflex HGB-E500EG epoxy, forming the composite[Stainless/Epoxy/Kapton/Epoxy/Stainless]. Thereafter, chemically etching1504 the two stainless steel plies with the desired spacer pattern.Retain only substrate and chip material, without bridges. Thereafter,chemically etch 1506 the Hanwhaflex epoxy plies with an identicalpattern to the stainless steel spacer. Thereafter, chemically etch 1508the Kapton film, leaving bridges to retain the stainless spacer towebbing. This step can be omit if Kapton is fully machined duringrelease steps.

It should be noted that the Prelaminated Spacer on Carrier Method canadditionally be used to join two consecutive spacers with differentpatterns in a μMECS laminate. The only required change to the aboveprocess is using different top and bottom masks for chemical etching.

FIG. 16 shows, in flow diagram form, a still further beneficial process1600 according to principles of the invention. In this process 1600three linkage laminates, L1-L3, are fabricated using the LinkagePre-Lamination Method discussed above in relation to process 1300. Eachlinkage laminate requires four photo-tools: two to define steel andadhesive, and two (identical) to define Kapton. Linkage laminates arefabricated as follows.

Laminate 1602 the two 0.0015″ stainless plies and 0.0005″ Kapton plyusing 0.0005″ Hanwhaflex HGB-E500EG adhesive, forming the symmetriccomposite [Stainless/Hanwhaflex/Kapton/Hanwhaflex/Stainless].Thereafter, laminate 1604 dry film photoresist to both sides of thecomposite. Subsequently, precisely register 1606 bottom and top sidephoto-tools and selectively pattern the resist. Thereafter, chemicallyetch 1608 both stainless steel plies, leaving islands of material forsubstrate and chips. This is followed by chemically etching 1610 theHanwhaflex plies to match the adjoining stainless steel, followed byresist strip. Thereafter, laminate 1612 a new dry film resist to bothsides; and thereafter precisely register 1614 Kapton pattern photo-toolsto the etched stainless and pattern the resist. Thereafter, selectivelyetch 1616 through the Kapton layer from both sides. Strip the resist1618. Kapton will serve as both flexure bridge and thin film carrier forthe linkage laminates.

The μMECS™ laminate consists of 3 linkage laminates, 7 spacers, and 9unique printed adhesive layers.

THC has seven stainless steel spacers of the following thicknesses: S1)0.002″, S2) 0.005″, S3) 0.011″, S4) 0.005″, S5) 0.005″, S6) 0.017″, S7)0.023″. All spacers are chemically etched on carrier using thePre-Laminated Spacer on Carrier Method (Section 4.4.1). The minimumfeature size in all plies is 150 jtm (0.006″), however typical minimumetched hole size is 110% material thickness. Excepting S1, each spaceris divisible by 0.005″ sub-laminates and 0.001″ adhesive between eachsub-laminate (e.g. S3 is constructed of two 0.005″ sub-laminates bondedby 0.001″ adhesive). Therefore, a standardized 0.005″ spacerconstruction is used: [Stainless/Epoxy/Kapton/Epoxy/Stainless], with0.0015″ 304 full hard stainless steel, 0.0005″ Hanwhaflex HGB-E500EGepoxy, and 0.0005″ DuPont Polyimide Kapton HN. The additional 0.001″adhesive between sub-laminates is printed during laminate assembly.

The THC is presented as an exemplary application of manufacturingprocess according to principles of the invention. THC is a nonlinearhaptic motor for mobile and wearable electronics. Its manufacturer isherewith described to illustrate the application of mass productionmethods to μMECS™ processing.

In this context FIG. 17 shows, in perspective view, a portion of a THC1700, prepared according to principles of the invention. Haptic actuator1700 includes, inter alia, a motor portion 1706. Motor portion 1706 iscoupled through a first transmission portion 1708 to a first inertialmass 1710. Motor portion 1706 is also coupled through a secondtransmission portion 1712 to a second inertial mass 1714.

In the illustrated embodiment, the motor portion 1706 includes a linearmotor apparatus having a movable armature coil 1716. The movablearmature coil 1716 is arranged generally concentrically about alongitudinal axis 1718 of a stator element 1720. The apparatus isarranged such that, during operation of the haptic actuator 1700, themovable armature coil 1716 moves substantially linearly in a directionsubstantially parallel to longitudinal axis 1718.

A keeper element, 1722 includes an external surface region 1724 and aninternal surface region 1726. A portion 1728 of external surface region1724 is disposed substantially normal to longitudinal axis 1718.Internal surface region 1726 defines an internal spatial region 1730 ofthe keeper element 1722, within which is disposed, at least, respectiveportions of stator element 1720 and armature coil 1716.

In certain embodiments of the invention, stator element 1720 includes apermanent magnet. In some embodiments of the invention, the keeperelement 1722 includes a permanent magnet. In other embodiments of theinvention, one or both of the stator element 1720 and the keeper element1722 exhibit negligible permanent magnetism.

In certain embodiments, one or more of the stator element 1720 and thekeeper element 1722 will include a respective plurality of laminatedsheets of magnetic material. In certain embodiments, the laminatedsheets of magnetic material will include iron as an elementary metaland/or as a chemical compound. One of skill in the art will appreciatethat, in certain embodiments, the keeper element 1722 will include afurther portion (not visible in FIG. 17) such that the keeper element1722 forms a substantially closed magnetic loop encircling the statorelement 1720.

In other words, the THC includes a magnetic voice coil actuator drivinga tungsten alloy mass through a μMECS™ linkage transmission. Thetransmission augments the linear voice coil motion and moves the massesalong a complex trajectory. Prototype fabrication of THC has beencarried out using the laser-based process outlined above with respect toFIG. 1.

An outline for a THC production process targeting >6 PPM throughput isoutlined here. This process highlights only μMECS™ laminate andsub-component assembly; sub-component manufacturing is omitted forclarity. One of skill in the art, however, readily understand andpractice the invention once in possession of the present disclosure.

The Bill of Materials THC consists of the following components:

-   -   1×μMECS laminate including:        -   3× Linkage sub-laminates;            [Stainless/Epoxy/Kapton/Epoxy/Stainless] constructed from            0.0015′ 2×AISI 304 FH stainless steel, 0.0005″ 1× Kapton HN            (DuPont), and 0.001″ Hanwhaflex HGB-E500EG (Hanwha L&C)            epoxy film adhe-sive.    -   7× Spacers; AISI 304 FH stainless steel (multiple thicknesses        0.002″-0.023″)    -   9× Unique adhesive layers; screen printed KATIOBOND 4595 (DELO)        UV pre-activated adhesive.    -   5× Intermediate, and 1× final release steps    -   2× Tungsten alloy masses    -   1× Coil    -   1× Magnet Assembly (NdFeB magnet and yoke)    -   1× Enclosure, which includes circuit traces for external routing        and bond pads for coil leads

In one embodiment of the invention, THC is manufactured in 600×600panels to achieve required tolerances using photochemical machiningprocesses. The total THC footprint is 20.8 mm×7.9 mm, and each panelcontains 50 components and fiducials for optical alignment.

FIG. 18 shows in schematic cross-section, a portion of a laminatecomposite structure 1800 highlighting certain linkages, spaces andprinted adhesive within the THC. As will be evident upon inspection ofthe figure, the illustrated laminate includes three linkage laminates,seven spaces and nine unique printed adhesive layers. These elements areillustrated as follows, including linkage layers [L1] 1802, [L2] 1804,and [L3] 1806. Also included are spacer layers[S1] 1808, [S2] 1810, [S3]1812, [S4] 1814, [S5] 1816, [S6] 1818 and [S7] 1820. These elements aresubstantially firmly coupled to one another with the illustratedadhesive layers 1822, 1824, 1826, 1828, 1830, 1831, 1832, 1834 and 1836.

The general process to fabricate S2-S7 spacers on carrier, using threephoto-tools per unique sub-laminate is shown in FIG. 19, in which theprocess is designated 1900 and includes the steps of:

-   -   1) Construct 1902 the [Stainless/Epoxy/Kapton/Epoxy/Stainless]        composite.    -   2) Selectively etch 1904 through both sides of stainless steel        (two masks), followed by epoxy etch 1906, to pattern substrate        and chip features.    -   3) Selectively etch 1908 through Kapton from one side (one        mask); the Kapton ply retains all features to webbing by        bridges. Spacers S3, S6, and S7 are constructed using two,        three, and four sub-laminates, respectively. S1 is a        single-sided 0.002″ [0.001″ stainless/0.0005″ epoxy/0.0005″        Kapton] composite, requiring only two photo-tools.

FIG. 20 A-D Illustrates, in flow diagram form, a portion of a detailedassembly process 2000 for an exemplary μMECS™ device prepared accordingto principles of the invention. With three linkage and thirteen spacersub-laminates in hand, the μMECS assembly process can begin. Thelamination adhesive is light curing KATIOBOND 45952 (DELO). The selectedadhesive is a thixotropic paste and can be screen printed to0.016″/0.006″ trace and space with 0.001″ bond line. KATIOBOND 45952 ispre-activated using 460 nm light for 5 seconds at 55 mW/cm2 intensity.Open time after pre-activation is 18 seconds. Final cure strength isreached 24 hours after exposure, however laminates are sufficientlybonded for further processing immediately following the open time.

The following lamination process 2000 is used to manu-facture THC (seeFIG. 9). For shorthand, refer to Linkages 1-3 as [L1] . . . [L3],spacers [S1] . . . [S7], and printed adhesive patterns identified bytheir adjoining sub-laminate (e.g. [L1-S5]).

-   -   1) Screen print adhesive 2002 pattern [S1-S2] onto spacer [S1]        (12 s/panel).    -   2) Pre-activate adhesive 2004 with 460 nm light (5 s/panel).    -   3) Optically register and Laminate 2006 spacer [S2] to [S1] (18        s/panel).    -   4) Intermediate laser (355 nm UV) Release 2008 of Kapton in        [S1/S2] (3 s/part).    -   5) Screen print adhesive 2010 pattern [S2-S3] onto spacer [S2]        (12 s/panel).    -   6) Pre-activate adhesive 2012 (5 s/panel).    -   7) Optically register and Laminate 2014 spacer [S3 a] to [S1/S2]        (18 s/panel).    -   8) Screen print adhesive 2016 pattern [S3-S3] onto spacer        [S1/S2/S3 a] (12 s/panel).    -   9) Pre-activate adhesive 2018 (5 s/panel).    -   10) Optically register and Laminate 2020 spacer [S3 b] to        [S1/S2/S3 a] (18 s/panel).    -   11) Screen print adhesive 2022 pattern [S3-S4] onto spacer        [S1/S2/S3] (12 s/panel).    -   12) Pre-activate adhesive 2024 (5 s/panel).    -   13) Optically register and Laminate 2026 spacer [S4] to        [S1/S2/S3] (18 s/panel). Set sub-laminate [S1/S2/S3/S4] aside.    -   14) Screen print adhesive 2028 pattern [L1-S5] onto linkage [L1]        (12 s/panel).    -   15) Pre-activate adhesive 2030 (5 s/panel).    -   16) Optically register and Laminate 2032 spacer [S5] to [L1] (18        s/panel).    -   17) Screen print adhesive 2034 pattern [S5-S6] onto laminate        [L1/S5] (12 s/panel).    -   18) Pre-activate adhesive 2036 (5 s/panel).    -   19) Optically register and Laminate 2038 spacer [S6 a] to        [L1/S5] (18 s/panel).    -   20) Screen print adhesive 2040 pattern [S6-S6] onto laminate        [L1/S5/S6 a] (12 s/panel).    -   21) Pre-activate adhesive 2042 (5 s/panel).    -   22) Optically register and Laminate 2044 spacer [S6 b] to        [L1/S5/S6 a] (18 s/panel).    -   23) Screen print adhesive 2046 pattern [S6-S6] onto laminate        [L1/S5/S6 ab] (12 s/panel).    -   24) Pre-activate adhesive 2048 (5 s/panel).    -   25) Optically register and Laminate 2050 spacer [S6 c] to        [L1/S5/S6 ab] (18 s/panel).    -   26) Screen print adhesive 2052 pattern [S6-L2] onto laminate        [L1/S5/S6] (12 s/panel).    -   27) Pre-activate adhesive 2054 (5 s/panel).    -   28) Optically register and Laminate 2056 linkage [L2] to        [L1/S5/S6] (18 s/panel).    -   29) Flip laminate 2058 [L1/S5/S6/L2] (1 s/panel).    -   30) Intermediate laser (355 nm UV) Release 2060 of Kapton in        [L2/S6/S5/L1] (3 s/part)    -   31) Flip laminate 2062 [L2/S6/S5/L1] (1 s/panel).    -   32) Intermediate laser (355 nm UV) Release 2064 of Kapton in        [L/S5/S6/L2] (3 s/part)    -   33) Remove Chips 2066 by vacuum from the work surface.    -   34) Screen print adhesive 2068 pattern [L2-S7] onto laminate        [L1/S5/S6/L2] (12 s/panel) face.    -   35) Pre-activate adhesive 2070 (5 s/panel).    -   36) Optically register and Laminate 2072 linkage [S7 a] to        [L1/S5/S6/L2] (18 s/panel).    -   37) Screen print adhesive 2074 pattern [S7-S7] onto laminate        [L1/S5/S6/L2/S7 a] (12 s/panel)    -   38) Pre-activate adhesive 2076 (5 s/panel).    -   39) Optically register and Laminate 2078 linkage [S7 b] to        [L1/S5/S6/L2/S7 a] (18 s/panel).    -   40) Screen print adhesive 2080 pattern [S7-S7] onto laminate        [L1/S5/S6/L2/S7 ab] (12 s/panel)    -   41) Pre-activate adhesive 2082 (5 s/panel).    -   42) Optically register and Laminate 2084 linkage [S7 c] to        [L1/S5/S6/L2/S7 ab] (18 s/panel).    -   43) Screen print adhesive 2086 pattern [S7-S7] onto laminate        [L1/S5/S6/L2/S7 abc] (12 s/panel)    -   44) Pre-activate adhesive 2088 (5 s/panel).    -   45) Optically register and Laminate 2090 linkage [S7 d] to        [L1/S5/S6/L2/S7 abc] (18 s/panel).    -   46) Screen print adhesive 2092 pattern [S7-L3] onto laminate        [L1/S5/S6/L2/S7] (12 s/panel)    -   47) Pre-activate adhesive 2094 (5 s/panel).    -   48) Optically register and Laminate 2096 linkage [L3] to        [L/S5/S6/L2/S7] (18 s/panel). Set sub-laminate        [L/S5/S6/L2/S7/L3] aside.    -   49) Screen print adhesive 2098 pattern [S4-L1] onto sub-laminate        [S1/S2/S3/S4] (12 s/panel).    -   50) Pre-activate adhesive 2100 (5 s/panel).    -   51) Optically register and Laminate 2102 sub-laminate        [L1/S5/S6/L2/S7] to [S1/S2/S3/S4] (18 s/panel).    -   52) Intermediate laser (355 nm UV) Release 2104 of Kapton in        [S1/S2/S3/S4/L1/S5/S6/L2/S7/L3] (11 s/part).    -   53) Remove Chips 2106 by vacuum from work surface.    -   54) Dispense KATIOBOND 45952 for Coil 2108 assembly (0.3        s/part).    -   55) Pre-activate adhesive 2110 (5 s/panel).    -   56) Pick and Place Coil 2112 into the laminate (0.3 s/part).    -   57) Dispense KATIOBOND 45952 for Mass 2114 assembly (0.6        s/part).    -   58) Pre-activate adhesive 2116 (5 s/panel).    -   59) Pick and Place Mass (2× per part) into the laminate 2118        (0.6 s/part).    -   60) Pick and Place 2120 Enclosure onto the laminate (0.3        s/part).    -   61) Laser Weld 2122 Enclosure to S1 base plate (0.3 s/part).    -   62) Laser Weld 2124 Coil leads to Enclosure bond pads (0.3        s/part). Flip laminate [S1/S2/S3/S4/L1/S5/S6/S6/L2/S7/L3] (1 s).    -   63) Dispense KATIOBOND 45952 for Magnetic Sub-Assembly 2126 bond        (0.3 s/part).    -   64) Pre-activate adhesive 2128 (5 s/panel).    -   65) Pick and Place Magnetic Sub-Assembly 2130 into the laminate        (0.3 s/part).    -   66) Final laser (355 nm UV) Release 2132 of Kapton in        [L3/S7/L2/S6/S5/L1/S4/S3/S2/S1] (15 s/part). The part will fall        from webbing.

The μMECS™ technology of the present invention will, in its variousembodiments, be practiced in a diverse set of materials including thosenow known in the art and those yet to be discovered. Virtually anymaterial in sheet, foil or film for can be included in a MECS™ laminate.However, a presently preferred set of materials prevails in most currentμMECS™ fabrication based on material properties, cost, andmanufactura-bility. The following is a short-list of materials, sortedby function, commonly used in μMECS™ components with large marketapplications.

-   -   Rigid structural (e.g. linkage and spacer), 0.001-0.01″        sheet/foil/film: Stainless steel, Cold rolled steel, Aluminum,        Copper, Polyimide, Polyester    -   Flexure, 0.0003-0.002″ film: Polyimide (e.g. Kapton), Polyester        (e.g. Mylar)    -   Adhesive, 0.0001-0.002″ cured bond line: Epoxies, Acrylics

As previously discussed, a process like that exemplified above withrespect to the THC module will be beneficially applied to a wide varietyof other millimeter scale electromechanical devices and systems.Accordingly, and with the intention of providing additional non-limitingexamples, it will be understood that μMECS™ technology is applicable tothe production various devices as discussed below.

FIGS. 21A and 21B show respectively, in linkage schematic form, alow-energy operational state 2100 and a high-energy operational state2102 of a haptic actuator device prepared at millimeter scale andemploying motion controlling linkages prepared with methods according tothe invention. Consistent with the THC described above, the deviceincludes a mechanical ground 2104 (here in the form of a case). Avarying electrical signal drives a voice coil 2106 in substantiallylinear oscillatory motion 2108 in what is here illustrated as a verticaldirection.

The oscillatory motion is coupled through respective μMECS™ mechanicallinkages 2110, 2112 into first 2114 and second 2116 oscillating masses.This imparts to the masses respective oscillatory motions 2118, 2120which in the low-energy operational state 2100 remains substantiallylinear. When configured at or near a natural frequency of the system,the masses 2114, 2116 tend to receive and accumulate energy supplied bythe voice coil 2106.

As energy accumulates, however, the system traverses a thresholdresulting in a transition of the motion of the masses 2114, 2116 fromthe linear trajectories 2118, 2120 more complex trajectories—illustrated2102 as respective J-trajectories 2122 2124. This change of trajectoryresults in a release of energy in a direction transverse to the originaloscillations 2118, 2120 of the masses and is experienced by a user ofthe device as a “tap.” It will be appreciated that a variety of othercomplex trajectories and configurations can be developed with devicesthat are prepared by processes that fall within the scope of the presentinvention.

FIGS. 22A and 22B show, respectively in schematic perspective view andlinkage schematic form, a low-energy operational state 2200 and ahigh-energy operational state 2202 of a further haptic actuator deviceprepared at millimeter scale according to principles of the invention.Like the device of 21A and 21B, this device accumulates energy from aninternal motor when operating in its low-energy state. In contrast tothe device discussed above, this energy is stored in angular momentum,rather than oscillating linear momentum. Nevertheless, when the devicemakes a transition from operational state 2200 to operational state2202, a portion of the stored energy is converted into a helical motionhaving upward component 2204 and resulting in a “tap” signal perceptibleto a user outside of the system. It should be noted that certainembodiments of a haptic actuator prepared in this configuration canproduce an extremely precise haptic signal.

FIG. 23A illustrates, in schematic cross-section, a substantiallyconventional Linear Resonant Actuator (LRA) 2300. The LRA includesmechanical ground 2302 in the form of a case, a Piezo electric driver2304, and an oscillating mass 2306 driven by the Piezo electric driver2304. When operating near a natural frequency of the system, asubstantial mechanical output can be produced.

However, as illustrated in FIG. 23B, a similar signal can be produced,by a device 2308 prepared according to principles of the invention,within a smaller spatial volume when the Piezo electric actuator 2310drives the mass 2312 through a single stage μMECS™ linkage 2314.Moreover, a similar effect can be produced while operating the Piezoelectric actuator at a lower frequency.

FIG. 23C shows a further μMECS™ device 2316 in which a two-stage linkage2318 is employed.

FIGS. 24A and 24B compare conventional acoustic transducers 2400, 2402to μMECS™ technology acoustic transducers 2406, 2408 respectively. Thepractitioner of ordinary skill in the art will readily ascertain thatthe voice coils 2408, 2410 of the conventional devices are disposed andmove coaxial to vertically oriented axes 2412, 2414.

In contrast, the driving coils 2416, 2418 of the μMECS™ devices move ina transverse direction and are coupled to respective output membranes2420, 2422 through respective μMECS™ mechanical linkages, 2424, 2426,2428, 2430. The result is that the μMECS™ devices exhibit improvedperformance including, without limitation, a superior output to volumeratio, as well as advantageous linear dimensions. In addition, a devicecan be prepared according to principles of the invention that producessuperior bass response as compared with a similarly sized conventionaldevice.

FIG. 25 similarly shows an acoustic transducer 2500 which exhibitssuperior output characteristics because it includes a μMECS™ mechanicallinkage 2502 that serves to amplify the effect of Piezo electric driver2504. The result, in certain embodiments, is improved efficiency and alarger acoustical output signal.

FIGS. 26A and 26B show respective first 2600 and second operationalstates 2602 of an optical zoom apparatus 2604 produced at millimeterscale and employing a mechanical linkage 2606 according to principles ofthe invention. In light of the present disclosure, one of ordinary skillin the art will readily appreciate the nature of the device and themanner in which it operates. Moreover, the practical benefits ofpreparing a similar device employing the teachings of the presentdisclosure will likewise be readily apparent.

FIG. 27 illustrates, in schematic cross-section, a portion of acombination haptic and acoustical transducer 2700. It will be apparentto one of skill in the art that the advantage of the present inventionallow the creation of millimeter scale devices never before practical oranticipated.

While a variety of systems and equipment, including equipment presentlyavailable on yet to be developed, will be advantageously employed in thepractice of the invention disclosed herewith, it may nevertheless behelpful to one of skill in the art to consider the following summary ofcore capital equipment.

-   -   5× Laser release modules    -   Galvo driven 10 W 355 nm UV DPSS Laser (e.g. LPKF MicroLine 2120        CI)    -   Vision system    -   Vacuum exhaust and chip removal    -   10× Lamination modules    -   Screen printer (e.g. SpeedPrint SP700)—    -   460 nm LED light array (e.g. 4× DELO DE-LOLUX 20)    -   Vision system    -   Lamination press    -   4× Pick and place assembly modules    -   SMT pick and place (e.g.    -   Vision system (e.g.    -   Adhesive delivery and dispense (e.g.—Laser welder    -   460 nm LED light array (e.g. 4× DELO DE-LOLUX 20)

The above is only one possible instantiation of an inline THC assemblyprocess. Maximum throughput at each node requires 15 lamination modules(screen print, light activation, registration, and lamination), 5 laserrelease modules, 4 pick and place assembly modules (pick and place,adhesive dispense, and UV activation). Clever process engineering canleverage under-utilized equipment for multiple tasks, using a cellulararrangement. Using the above process time estimates, the lowestthroughput process is final laser release (15 s/part, 4 PPM). A 4 PPMprocess can be accomplished using 1 lamination module (91 PPM), 3 laserrelease modules (4-8 PPM), and 1 pick and place module (10-15 PPM).

While the exemplary embodiments described above have been chosenprimarily from the field of optical communication, one of skill in theart will appreciate that the principles of the invention are equallywell applied, and that the benefits of the present invention are equallywell realized in a wide variety of other communications systemsincluding, for example, electronic command and control systems. Further,while the invention has been described in detail in connection with thepresently preferred embodiments, it should be readily understood thatthe invention is not limited to such disclosed embodiments. Rather, theinvention can be modified to incorporate any number of variations,alterations, substitutions, or equivalent arrangements not heretoforedescribed, but which are commensurate with the spirit and scope of theinvention. Accordingly, the invention is not to be seen as limited bythe foregoing description, but is only limited by the scope of theappended claims.

1. (canceled)
 2. A high-speed method for forming a millimeter-scalelinkage laminate structure comprising: providing a first ply ofrelatively rigid mechanical material, said first ply having a firstsurface region and a second surface region disposed in substantiallyparallel spaced relation to said first surface region; coupling saidfirst surface region of said first ply to a second ply of sacrificialfilm carrier material; applying a patterned photoresist material to saidsecond surface region; selectively etching said first ply to form atleast one substrate island and at least one chip island, said substrateand chip islands being respectively coupled to said second ply ofsacrificial film carrier material; selectively coupling said at leastone substrate island to a relatively flexible ply material to form saidlinkage laminate structure; and removing said second ply of sacrificialfilm carrier material to release said linkage laminate structure fromsaid sacrificial film carrier material and said at least one chipisland.
 3. A high-speed method as defined in claim 2 wherein said secondply of sacrificial film carrier material comprises a soluble filmmaterial and where said removing said second ply of sacrificial filmcarrier material comprises dissolving said sacrificial film carriermaterial.
 4. A high-speed method as defined in claim 3 wherein saidsoluble film material comprises an isopropynol-soluble material.
 5. Ahigh-speed method as defined in claim 2 wherein said second ply ofsacrificial film carrier material comprises a thermally decomposing filmmaterial and where said removing said second ply of sacrificial filmcarrier material comprises decomposing said sacrificial film carriermaterial.
 6. A high-speed method as defined in claim 5 wherein saiddecomposing said sacrificial film carrier material comprises chemicallydecomposing said sacrificial film carrier material.
 7. A high-speedmethod as defined in claim 5 wherein said decomposing said sacrificialfilm carrier material comprises evaporating said sacrificial filmcarrier material.
 8. A high-speed method as defined in claim 2 whereinsaid second ply of sacrificial film carrier material comprises a meltingfilm material and where said removing said second ply of sacrificialfilm carrier material comprises heating said sacrificial film carriermaterial.
 9. A high-speed method as defined in claim 8 wherein saidmelting film material comprises a hot melt material.
 10. A high-speedmethod as defined in claim 8 wherein said melting film materialcomprises a wax material.
 11. A high-speed method as defined in claim 2wherein said second ply of sacrificial film carrier material comprises abiodegradable film material.
 12. A high-speed method as defined in claim11 wherein said biodegradable film material comprises a biodegradablepolyethylene terephthalate (PET) material.
 13. A high-speed method asdefined in claim 2 wherein said first ply of relatively rigid mechanicalmaterial comprises a metallic material.
 14. A high-speed method asdefined in claim 13 wherein said metallic material comprises at leastone of a stainless steel material, a spring steel material, and ametallic alloy material.
 15. A high-speed method as defined in claim 2wherein said selectively etching said first ply comprises etching saidfirst ply in a batch processing tank system.
 16. A high-speed method asdefined in claim 2 wherein said selectively etching said first plycomprises etching said first ply in a continuous processing conveyorsystem.
 17. A high-speed method as defined in claim 2 wherein saidselectively coupling said at least one substrate island to a relativelyflexible ply material comprises adhesive jet printing an adhesivematerial onto a surface region of said at least one substrate islandand, thereafter, disposing said relatively flexible ply material intocontact with said adhesive material.
 18. A high-speed method as definedin claim 2 wherein said selectively coupling said at least one substrateisland to a relatively flexible ply material comprises disposing a diecut adhesive film onto a surface region of said at least one substrateisland and, thereafter, disposing said relatively flexible ply materialinto contact with said die cut adhesive film.
 19. A high-speed method asdefined in claim 2 wherein said selectively coupling said at least onesubstrate island to a relatively flexible ply material comprisesadhesive transfer printing an adhesive material onto a surface region ofsaid at least one substrate island and, thereafter, disposing saidrelatively flexible ply material into contact with said adhesivematerial.
 20. A high-speed method as defined in claim 2 wherein saidselectively coupling said at least one substrate island to a relativelyflexible ply material comprises adhesive spraying an adhesive materialonto a surface region of said at least one substrate island and,thereafter, disposing said relatively flexible ply material into contactwith said adhesive material.
 21. A high-speed method as defined in claim2 wherein said selectively coupling said at least one substrate islandto a relatively flexible ply material comprises screen printing anadhesive material onto a surface region of said at least one substrateisland and, thereafter, disposing said relatively flexible ply materialinto contact with said adhesive material.